1-2013266-1 datasheet

Маркировка

1-2013266-1
Производитель

TE Connectivity
Описание

TE Connectivity 1-2013266-1 Application Type: DDR III Center Key (mm [in]): Offset Left Center Post: Without Centerline (mm [in]): 1.00 [0.039] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Material Color: Natural Ejector Type: Standard Housing Color: Black Housing Material: High Temperature Nylon Insertion Style: Direct Insert Keying: Standard Lead Free Solder Processes: Not relevant for lead free process Module Orientation: Vertical Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 240 Number Of Rows: Dual Packaging Method: Tray Pcb Mount Style: Through Hole Retention Post(s) Location: Both Ends Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 1.90 [0.075] Socket Style: DIMM Socket Type: Memory Card Solder Tail Contact Plating: Tin-Lead (100) over Nickel (50) Termination Post Length (mm [in]): 2.40 [0.094] Ul Flammability Rating: UL 94V-0
Количество страниц

3 шт.
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PDF
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384,29 KB